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High power LED lamp instructions

A.LED shipment and save

Use Notice:

HIGH POWER series LED products should avoid squeezing bags in storage,transport process.

  1. Storage environment is kept clean and free of other compounds, and avoid foreign matter such as dust entering lens or adhesion silicon colloid surface to cause pollution and then influence the effect of light.
  2. Avoid storing LED in high humidity or acidic environment, HIGH POWER series LED products are recommended to store in moisture-proof cabinet.
  3. To avoid contacting with corrosive chemical gases and substances (such as sulfur element, such as halogen material).

High power LED lamp

B. LED ESD protection

LED's are static sensitive devices, and anti-static capabilities of various chips is different. Therefore, users must strengthen to prevent static electricity during semi-finished and finished products assembly process, how to work hard to prevent static electricity and eliminate static electricity work. The main measures are:

  1. Workshop, work surfaces need anti-static floor and effectively grounded.
  2. Production equipment and testing equipment are required to effectively be grounded, and equipped with an electrostatic ion fan to strengthen its protection.
  3. In the process of operation ,the operating personnel must wear anti-static clothing, anti-static wrist strap and gloves when touching LED products, please take part PPA in order to avoid electrostatic damage.
  4. Work humidity maintained at about 60% RH, in case the dry air cause static electricity.

C. LED applicative circuit design

A reasonable arrangement Design should be selected for LED applicative circuit based on LED features , In the Application products circuit design, the constant current drive circuit should be used, and can not exceed its maximum specified current through the LED. It also requires the use of current-limiting resistor to avoid the smaller voltage changes caused large current changes, resulting in LED products damaged.

Characteristics of LED occur changes easily because of their heat and in ambient temperature changes. Temperature build-up will reduce the LED luminous efficiency, impact luminous color, etc., so the design should take full account of the heat.

D. LED assembly methods

All staff in direct contact with the LED in the LED assembly operations entire process must make relevant measures to prevent and eliminate static electricity, which measures refer to “the relevant requirements of LED static protection". Meanwhile, Please ensure that the ambient temperature in the workshop between 20-25 ℃, humidity within range 50% RH-60% RH .

When gripping LED light source assembling jobs , only touching the bracket body, prohibiting using tools like tweezers to put lens and silicone gel pressure, but may not use tools like tweezers to poke and push the lens and packaging colloids.

In the assembly operation, the non-containing N, P, S and other organic compounds containing Sn, Pb, Hg, Sb, Bi, As and other heavy metal ion compound, and an organic compound containing an unsaturated group such as ethynyl, and to prevent plastic packaging catalyst toxic reactions occur, resulting in curing disorder, which affects the reliability of the LED light source. Fill in the need to use outside, sealants, please make sure when thermal plastic containing more than its substance or minor first try after sealing high-temperature aging lit confirmation.

E. LED Welding condition

LED Welding methods include iron soldering, reflow soldering. Lambertian conventional lens products HIGH POWER series of LED light source, integrated light source products, COB products can only use the soldering iron way.the highest temperature for iron soldering is 350 ℃, the welding time is not more than 3S, and soldering location should be more than 2mm away from PPA and the encapsulation

The specific requirements are:

PCB substrate

  1. LED light source and the assembly must be attached, and no rosin joint phenomenon.
  2. In order to strengthen the combination degree between the substrate and the heat sink, suggest 100um thickness layer of thermally Conductive Silicone coated evenly at the bottom on of LED substrate and on the heat sink surface , do not coated too thick, in case that it forms insulating layer and reduces its thermal effect.
  3. The shielding cover of LED integrated module light source surface must not be taken down during the welding process, so as to avoid to stain colloid surface because of welding materials and packaging spray ,then cause the packaging colloid adverse reactions,forbidden other welding methods . (welding heating platform, will make the product exist in swell, upsurge temperature environment, will lead serious quality problems!)

F. Heat radiation treatment

  1. LED will turn about 70% of the electrical energy into heat energy, if the heat can not effectively and timely transfer outside,the LED PN junction temperature inside will continue to rise, the light output decrease, leading light decay too quickly, and finally the lamp die. Therefore, to solve the heat dissipation problem has become a prerequisite for power LED applications.
  2. According to the characteristics of the product and the long time aging experiments data experience, for heat dissipation of high power LED applications, we propose the following:
  3. Radiating shell 1 reasonable
  4. We recommend the use of aluminum or copper fins with fin.

Effective radiating area

For 1W high power LED light source, we recommend fin’s effective radiating area summation ≥ 30 c㎡, for 3W products, recommend fin’s effective total surface area ≥ 80c㎡, higher power according to the case and the experimental results, make sure that the LED heat sink’s(non radiator )temperature does not exceed 60 ℃).

Good connection

Between the substrate and the heat sink of High power LED,it is coated with a layer of thermally conductive silicone (silicone grease thermal series ≥ 3.0W/M.K) or paste connected Please don’t coat too thick or silicon of poor quality,(the thickness is below 100 um in case no thermal effect is expected, but form the insulation layer, thus affecting the heat radiation effect

G. LED Cleaning method

LED cleaning should avoid using unknown chemical liquid or acidic solvents as cleaning fluid, in the use of cleaning solvent, please confirm whether or not the chemical components will cause corrosion to silicon colloidal silver plating layer, support, resulting LED characteristics change or functional damage. We usually recommend the use of ethanol as LED cleaning solvents, when the lamp body needs cleaning the lamp body, firstly with a clean soft cotton gauze dipped in alcohol, gently wipe the body surface dirt (to prevent the internal structure of excessive abrasion packaging colloid or destroy the lamp body), drying naturally placed in the constant temperature ,At the same time, should try to avoid the LED source immersed in ethanol solution.

H.LED electrical test and application notes

LED application notes:

  1. LED is a constant flow components, should avoid using constant voltage mode to light and ensure LED work persistence reliability
  2. You should strengthen the considerations for the problem of heat dissipation in the whole process of using LED,for example: placing thermal resistance on LED circuit board ,LED placed density and other components of the heating coefficient.
    LED does not allow the reverse driving, and the current of the circuit pulse should be far less than the limit value of LED specifications, to avoid possible EOS (electrical overload) breakdown.
    current limiting measure is necessary, otherwise the voltage change slightly will cause larger current changes , may cause the failure of LED.
  3. On the premise that the light output meet the requirements ,recommend use of the drive current lower than the rated current, which helps to improve the reliability and efficiency of light products.
  4. Products in the application of waterproof processing, assembly, installation , should avoid contacting with acidic chemical materials and solvents in the process, further more don’t bond LED products with acid.

Because even the same specifications LED, in practical applications its reliability is related to the overall system design, operation mode, operating conditions closely, the use manual may not encounter all the problems in the process of customer use, the resulting inconvenience, please understand! To this end, we will base on your typical case and information feedback in the actual use of the process , provide related technical analysis and with or without regular updating the manual, If occurring information change during the time , will do not notice.

Especially, If the damage caused by your storage, operation, inadequate protection, assembly defect or not according to the manual way of our company,Our company will not bear the responsibility for compensation.

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